Printed Circuit Board

MAGNETO® Anodes are a critical part of the Printed Circuit Board manufacturing process

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The story of Magneto Special Anodes begins in 1957, when Dr. Henri Beer applied for the patent of the titanium anode. Since then, the company has been through tremendous development.

Evoqua Magneto has three locations based across the globe to support our customers:

Schiedam, Netherlands
Suzhou Industrial Park, Jiangsu Province, China
Union NJ, USA

Contact Us to learn more about our Special Anode solutions.

Hole metallization and plating technology are widely used in PCB manufacturing procedures to solve the key problems of interlayer connection or conduction. In the process of acidic copper plating in PCB, special organic additives are added to generate a metal deposit layer with fine grain, uniform copper distribution on the board and preferable via filling ability. In this process, the coating design of insoluble titanium anode plays a role in ensuring the uniformity of current distribution and controlling the reasonable and effective additive consumption.


  • PCB VCP DC Copper Plating
  • Through hole and blind hole copper plating
  • Blind hole and through hole via filling plating
  • PCB RPP Copper Plating Horizontal pulse plating - through hole filling plating
  • Vertical pulse plating - high aspect ratio through hole plating
  • PCB Gold Plating
  • Semiconductor Plating
  • RTR plating
  • Lead frame plating

Products and Services

  • Special Selecta ® mixed metal oxide (MMO) coated titanium anode for VCP
  • Special mixed metal oxide (MMO) coated titanium anode for RPP
  • Development of coatings with low consumption of additives (based on specific additive types)
  • Platinised anode (titanium based or niobium based optional)
  • Recoating of plate anode (over 3mm)
  • Quantitative detection of additive consumption (CVS) [Selection Information]

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Contact Magneto Special Anodes today!

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